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INTEL Xeon 5315Y 3.20GHz CPU

Original price was: $1,025.00.Current price is: $1,018.00.

Full Specification Table

Parameter Specification
Product Family 3rd-Generation Intel Xeon Scalable (Ice Lake-SP)
Model Intel Xeon Gold 5315Y
Cores / Threads 8 / 16
Base Clock 3.20 GHz
Max Turbo Clock 3.60 GHz
L3 Cache 12 MB
Process Node 10 nm
Socket FCLGA4189
TDP 140 W
Memory Support DDR4-2933 (ECC supported)
Maximum Memory Capacity (per socket) Up to 6 TB (platform dependent)
Memory Channels 8 (depends on motherboard)
UPI Links 3
Maximum SMP Configuration 2-socket (2P)
Instruction Set & Extensions 64-bit, AVX-512, AVX2, AVX, AES-NI, SSE4.2, virtualization (VT-x / VT-d), ECC support
Intended Use Server, embedded server, virtualization, storage, edge computing
BrandIntel
Status1000 in stock
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Overview

The Intel Xeon Gold 5315Y belongs to Intel’s 3rd-Generation Xeon Scalable “Ice Lake-SP” lineup. With a relatively modest core count but high base and boost clocks, it targets use cases where single-thread efficiency, power efficiency, and compact server or embedded deployment matter more than maximum core density.

With 8 physical cores and 16 threads, this CPU strikes a balance between performance and energy consumption. It supports high-speed DDR4 memory, large total system memory capacity, and server-grade reliability features, making it suitable for small to mid-size servers, edge computing nodes, storage servers, virtualization of light workloads, or compact enterprise appliances.


Key Features

  • 8 cores, 16 threads — suitable for lightweight to moderate server workloads

  • 3.20 GHz base frequency, up to 3.60 GHz turbo — strong per-core performance

  • 12 MB shared L3 cache for efficient data access

  • Support for DDR4-2933 memory with large system memory capacity (up to 6 TB in many platforms)

  • 140 W TDP — moderate power draw for server class, suitable for dense or compact builds

  • Ice Lake-SP architecture — modern 10 nm process with associated performance and efficiency gains

  • Enterprise-class reliability, virtualization support, and compatibility with dual-socket server platforms


Full Specification Table

Parameter Specification
Product Family 3rd-Generation Intel Xeon Scalable (Ice Lake-SP)
Model Intel Xeon Gold 5315Y
Cores / Threads 8 / 16
Base Clock 3.20 GHz
Max Turbo Clock 3.60 GHz
L3 Cache 12 MB
Process Node 10 nm
Socket FCLGA4189
TDP 140 W
Memory Support DDR4-2933 (ECC supported)
Maximum Memory Capacity (per socket) Up to 6 TB (platform dependent)
Memory Channels 8 (depends on motherboard)
UPI Links 3
Maximum SMP Configuration 2-socket (2P)
Instruction Set & Extensions 64-bit, AVX-512, AVX2, AVX, AES-NI, SSE4.2, virtualization (VT-x / VT-d), ECC support
Intended Use Server, embedded server, virtualization, storage, edge computing

Performance Positioning & Use Cases

1. Compact / Edge / Embedded Servers

The 5315Y’s combination of 8 cores and high clock speeds makes it ideal for compact servers, edge deployments, network appliances, storage-oriented servers, and enterprise-class embedded systems.

2. Virtualization for Lightweight Workloads

It can host multiple lightweight virtual machines or containers — suitable for development environments, small-scale cloud services, or microservices architectures — without excessive power consumption or heat output.

3. Storage, Infrastructure & Control Servers

With high memory capacity and reliability features, it is well-suited for storage controllers, backup servers, caching servers, or infrastructure nodes that require moderate CPU throughput but stable memory and I/O support.

4. Balanced Single-Thread and Multi-Thread Workloads

Tasks that benefit from moderately high per-core performance — such as web servers, application servers, certain database workloads, or control-plane applications — are good fits for 5315Y.


Advantages & Limitations

Advantages

  • Balanced 8-core / 16-thread design achieves efficient per-core performance with reasonable power draw.

  • Modern Ice Lake-SP 10 nm architecture supporting DDR4-2933 and large memory capacity.

  • Good for compact servers, edge computing, and virtualization of light workloads.

  • Enterprise-class features including ECC, virtualization, and reliability support.

Limitations

  • Lower core count limits throughput-heavy, high-density VM or HPC workloads.

  • L3 cache and core count may be modest compared to high-end Xeon models.

  • Not ideal for heavily parallel workloads or very large-scale data center tasks.

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