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INTEL Xeon 6250 3.90GHz CPU

Original price was: $3,144.00.Current price is: $3,134.00.

Full Specification Table

Parameter Specification
Product family 2nd-Generation Intel Xeon Scalable (Cascade Lake)
Processor model Intel Xeon Gold 6250
Cores / Threads 24 / 48
Base frequency 2.70 GHz
Max turbo frequency 3.90 GHz
L3 cache 35.75 MB
Lithography 14 nm
Socket FCLGA3647
TDP 150 W
Memory type DDR4-2933 (ECC supported)
Memory channels 6
Max memory capacity Platform dependent (commonly up to 1 TB per CPU)
PCIe support PCIe 3.0, up to 48 lanes (platform dependent)
UPI links 2
Max CPU configuration Dual-socket
Instruction set 64-bit
Instruction extensions AVX, AVX2, AVX-512, AES-NI, Intel DL Boost
Virtualization support Intel VT-x, VT-d, EPT
Reliability & security ECC memory, enterprise RAS features
Target applications Virtualization, cloud servers, databases, analytics, enterprise workloads
BrandIntel
Status1000 in stock
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Overview

The Intel Xeon Gold 6250 is a high-core-count processor in the 2nd-Generation Intel Xeon Scalable (Cascade Lake) family. It is designed to deliver a balanced combination of multi-core throughput, high memory bandwidth, and energy efficiency, making it suitable for virtualization, cloud computing, database servers, analytics, and enterprise applications.

With 24 cores and 48 threads, the Xeon Gold 6250 provides excellent parallel processing capabilities. Its six-channel DDR4 memory support, AVX-512 acceleration, and enterprise-grade reliability features ensure robust performance in dual-socket server deployments.


Key Features

  • 24 cores and 48 threads for heavy multi-threaded workloads

  • 2.70 GHz base frequency with up to 3.90 GHz turbo for burst performance

  • 35.75 MB L3 cache for accelerated data access

  • Six-channel DDR4 memory support for high throughput

  • 150 W TDP for energy-efficient performance

  • AVX-512 and Intel Deep Learning Boost for specialized workloads

  • Supports dual-socket server platforms


Full Specification Table

Parameter Specification
Product family 2nd-Generation Intel Xeon Scalable (Cascade Lake)
Processor model Intel Xeon Gold 6250
Cores / Threads 24 / 48
Base frequency 2.70 GHz
Max turbo frequency 3.90 GHz
L3 cache 35.75 MB
Lithography 14 nm
Socket FCLGA3647
TDP 150 W
Memory type DDR4-2933 (ECC supported)
Memory channels 6
Max memory capacity Platform dependent (commonly up to 1 TB per CPU)
PCIe support PCIe 3.0, up to 48 lanes (platform dependent)
UPI links 2
Max CPU configuration Dual-socket
Instruction set 64-bit
Instruction extensions AVX, AVX2, AVX-512, AES-NI, Intel DL Boost
Virtualization support Intel VT-x, VT-d, EPT
Reliability & security ECC memory, enterprise RAS features
Target applications Virtualization, cloud servers, databases, analytics, enterprise workloads

Architecture Highlights

  • Based on the Cascade Lake microarchitecture optimized for multi-threaded workloads and energy efficiency.

  • AVX-512 and Intel Deep Learning Boost accelerate vectorized and AI inference tasks.

  • Six-channel memory architecture ensures high bandwidth for large datasets and database workloads.

  • Enterprise-class RAS and virtualization features improve stability and uptime in production environments.


Performance Positioning & Recommended Workloads

  • Virtualization & Cloud: High core count and multi-threading provide excellent VM density.

  • Database & Analytics: Large L3 cache and memory bandwidth accelerate OLTP, OLAP, and in-memory workloads.

  • High-Performance Computing (HPC): AVX-512 support improves simulation, engineering, and computational workloads.

  • Enterprise Applications: Suitable for ERP, CRM, financial systems, and latency-sensitive applications.


Pros & Cons

Pros

  • Excellent multi-threaded performance with 24 cores / 48 threads

  • Energy-efficient design with 150 W TDP

  • Strong memory bandwidth with six DDR4 channels

  • AVX-512 and DL Boost for specialized workloads

Cons

  • PCIe 3.0 may limit next-generation accelerator performance

  • Based on 14 nm architecture; newer processors may offer PCIe 4.0/5.0

  • Dual-socket cooling and power planning required for full performance

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