Intel Xeon Gold 6134 – Complete Specifications
| Parameter | Details |
|---|---|
| Processor Family | Intel Xeon Scalable (“Gold”) |
| Model Number | 6134 |
| Microarchitecture / Codename | Skylake-SP |
| Process Node | 14 nm |
| Number of Cores | 8 physical cores |
| Number of Threads | 16 (Hyper-Threading enabled) |
| Base Clock Frequency | 3.20 GHz |
| Maximum Turbo Frequency | 3.70 GHz |
| L1 Cache | 512 KB (64 KB per core for data + 32 KB per core for instructions) |
| L2 Cache | 1 MB per core (8 MB total) |
| L3 Cache | 24.75 MB (shared) |
| Thermal Design Power (TDP) | 130 W |
| Maximum Case Temperature (Tcase) | 79 °C |
| Memory Type | DDR4-2666 ECC |
| Memory Channels | 6 (hexa-channel) |
| Maximum Memory Supported | 768 GB |
| PCI Express (PCIe) Lanes | Up to 48 lanes (PCIe 3.0) |
| Interconnect / Links | 3 × UPI links at 10.4 GT/s |
| Socket Type | FCLGA3647 |
| Advanced Features & Technologies | – Intel Turbo Boost 2.0 – Hyper-Threading Technology – Intel AVX, AVX2, AVX-512 with 2 FMA units – Intel TSX-NI (Transactional Synchronization Extensions) – Intel 64-bit Architecture – Execute Disable Bit (DEP) – Virtualization: VT-x, VT-d, EPT – Intel Trusted Execution Technology (TXT) – AES New Instructions (AES-NI) – Intel Speed Shift Technology |
| Launch Date | Q3 2017 |
| Status | Discontinued (End of servicing updates: 2023) |
Key Features and Advantages
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High Core Performance
The Xeon Gold 6134’s 3.20 GHz base clock and 3.70 GHz turbo provide strong single-core performance for both enterprise and compute-intensive workloads. -
Efficient Multithreading
With 8 cores and 16 threads, the CPU efficiently handles multi-threaded tasks such as virtualization, database processing, and multi-user environments. -
Large Cache Memory
Featuring a 24.75 MB L3 cache, it reduces latency for frequently accessed data, enhancing performance in memory-intensive applications. -
High Memory Capacity & Bandwidth
Support for 768 GB DDR4 memory across six channels provides ample bandwidth for large-scale applications, simulations, and database workloads, with ECC support for reliability. -
Scalable I/O & Expansion
With 48 PCIe 3.0 lanes, the CPU can connect multiple NVMe drives, high-speed networking cards, or GPUs, making it ideal for high-I/O server systems. -
Advanced Instruction Sets
Support for AVX-512, AVX2, and AVX enables accelerated vector computations, scientific workloads, and data analytics tasks. TSX-NI improves concurrency in supported applications. -
Enterprise Security & Virtualization
The processor includes VT-x, VT-d, TXT, and AES-NI, providing strong virtualization and security features for enterprise environments. -
Server-Grade Reliability
Designed for continuous operation with ECC memory support and robust thermal specifications (TDP 130 W), ensuring long-term stability in server deployments.
Limitations and Considerations
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Older Generation Architecture: Skylake-SP design is not as power-efficient as newer Xeon generations.
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Discontinued Status: End-of-service updates in 2023; may not be ideal for new, long-term deployments.
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No Integrated Graphics: Requires dedicated GPU for graphical workloads.
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Platform Cost: LGA3647 motherboards and hex-channel memory are typically more expensive.
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Power Consumption: TDP of 130 W requires proper cooling and energy planning in server environments.
Ideal Use Cases
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Virtualization Servers – Capable of running multiple virtual machines or containers efficiently.
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Database Servers – High memory bandwidth and cache make it suitable for transactional or in-memory databases.
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Enterprise Workstations – Excellent for CAD, simulations, and other compute-intensive applications.
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Analytics & HPC – AVX-512 and large cache accelerate scientific, analytics, and AI workloads.
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High-I/O Applications – Supports numerous PCIe devices for storage and networking-intensive tasks.
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